The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2010

Filed:

Aug. 15, 2007
Applicants:

Thorsten Meyer, Regensburg, DE;

Markus Brunnbauer, Lappersdorf, DE;

Stephan Bradl, Regensburg, DE;

Inventors:

Thorsten Meyer, Regensburg, DE;

Markus Brunnbauer, Lappersdorf, DE;

Stephan Bradl, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit includes a substrate including a contact pad, a redistribution line coupled to the contact pad, and a dielectric material layer between the substrate and the redistribution line. The integrated circuit includes a solder ball coupled to the redistribution line and a parylene material layer sealing the dielectric material layer and the redistribution line.


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