The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Apr. 17, 2008
Kazuo Okada, Gunma, JP;
Hiroyuki Shinogi, Gunma, JP;
Yoshinori Seki, Gunma, JP;
Hiroshi Yamada, Kanagawa, JP;
Kazuo Okada, Gunma, JP;
Hiroyuki Shinogi, Gunma, JP;
Yoshinori Seki, Gunma, JP;
Hiroshi Yamada, Kanagawa, JP;
Sanyo Semiconductor Co., Ltd., Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
The invention enhances moisture resistance between a supporting body and an adhesive layer to enhance the reliability of a semiconductor device. A semiconductor device of the invention has a first insulation film formed on a semiconductor element, a first wiring formed on the first insulation film, a supporting body formed on the semiconductor element with an adhesive layer being interposed therebetween, a third insulation film covering the back surface of the semiconductor element onto the side surface thereof and the side surface of the adhesive layer, a second wiring connected to the first wiring and extending onto the back surface of the semiconductor element with the third insulation film being interposed therebetween, and a protection film formed on the second wiring.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile