The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Jul. 26, 2006
Laurent Stauffer, Widnau, CH;
Peter Kipfer, Marbach, CH;
Heinz Bernhard, Berneck, CH;
Leica Geosystems AG, Heerbrugg, CH;
Abstract
The invention relates to a method for high-precision fixing of a miniaturized component (), in particular having a microoptical element (), on a predetermined fixing section () of a support plate () by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region () which encloses the fixing section (), is bridged by at least one connecting web () of the support plate (), keeps the heat transfer from the fixing section () to the remaining support plate low and compensates lateral thermal expansions of the fixing section (). Solder material () is applied on the top of the fixing section (). The method comprises in particular the steps: arrangement of the component () above the fixing section (), the solder material () and the base () of the component () being present in opposite positions without contact and forming a space. Supply of electromagnetic radiation () to the bottom () of the fixing section () for melting the solder material (') so that, as a result of drop formation and optionally as a result of lowering of the component () the space fills with molten solder material (′) for mutual fixing. Waiting for the mutual fixing by resolidification of the molten solder material (′).