The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Sep. 28, 2006
Makoto Murai, Isehara, JP;
Ryosuke Usui, Ichinomiya, JP;
Makoto Murai, Isehara, JP;
Ryosuke Usui, Ichinomiya, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile