The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Jun. 30, 2006
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
Hirohisa Matsuki, Kawasaki, JP;
Yoshitaka Aiba, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Tadahiro Okamato, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Yoshitaka Aiba, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Tadahiro Okamato, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A semiconductor device includes a first semiconductor chip () having a first terminal () on one surface, a second semiconductor chip () which is larger than the first semiconductor chip () and on which the first semiconductor chip () is stacked and which has a second terminal () on one surface, an insulating layer () formed on a second semiconductor chip () to cover the first semiconductor chip (), a plurality of holes () formed in the insulating layer () on at least a peripheral area of the first semiconductor chip (), a via () formed like a film on inner peripheral surfaces and bottom surfaces of the holes () and connected electrically to the second terminal () of the second semiconductor chip (), a wiring pattern () formed on an upper surface of the insulating layer (), and an external terminal () formed on the wiring pattern ().