The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2010

Filed:

Mar. 21, 2007
Applicants:

Tatsuoki Kohno, Tokyo, JP;

Shin-ichi Orimo, Sendai, JP;

Yuko Nakamori, Sendai, JP;

Inventors:

Tatsuoki Kohno, Tokyo, JP;

Shin-ichi Orimo, Sendai, JP;

Yuko Nakamori, Sendai, JP;

Assignees:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Tohoku University, Sendai-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 30/00 (2006.01); H01M 4/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A hydrogen occlusive alloy has a cubic structure and a composition represented by the following general formula (1):(MgL)(NiMLi)  (1)where the element L is at least one element selected from the group consisting of Na, Cs, Ca, Sr, Ba, Sc, Ti, Zr, Hf, V, Nb, Ta, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, the element M is at least one element selected from the group consisting of Cr, Mo, W, Mn, Fe, Co, Pd, Pt, Cu, Ag, Zn, Cd, B, Al, Ga, In, Si, Ge, Sn, Pb, Sb and Bi, and mole ratios X, Y, Z and m are 0<X≦0.5, 0<Y≦0.5, 0.1≦Z≦0.9, and 1.8≦m≦2.2, respectively.


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