The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2010

Filed:

Dec. 22, 2003
Applicants:

Renuga Gopal, Singapore, SG;

Kazutoshi Fujihara, Singapore, SG;

Seeram Ramakrishna, Singapore, SG;

Chong-lin Chew, Singapore, SG;

Ganesh V. Kumar, Singapore, SG;

Kelvin W. C. Foong, Singapore, SG;

Poey-ling Loh, Singapore, SG;

Inventors:

Renuga Gopal, Singapore, SG;

Kazutoshi Fujihara, Singapore, SG;

Seeram Ramakrishna, Singapore, SG;

Chong-Lin Chew, Singapore, SG;

Ganesh V. Kumar, Singapore, SG;

Kelvin W. C. Foong, Singapore, SG;

Poey-Ling Loh, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 53/02 (2006.01); A61C 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fiber reinforced composite is formed using a shrinkable die. A composite of fiber and resin is placed in the die and is compressed by shrinking the die to form a desired transverse cross-section. Optionally, the die is bent along its lengthwise extent to shape the composite in the die. After shrinking and optional shaping, the composite is cured to form the fiber reinforced composite.


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