The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7757394 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 20, 2010

Filed:

Aug. 29, 2005
Applicant:

Yoshio Watanabe, Kanagawa, JP;

Inventor:

Yoshio Watanabe, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer wiring board having a plurality of wiring layers is proposed, which is prepared by a process having the steps of: forming, on one insulating sheet, wiring patterns for all the wiring layers, which patterns are arranged at predetermined positions; and folding the insulating sheet having formed the wiring patterns in the predetermined order and stacking the folded sheet while positioning, and then heating the resultant sheet in a vacuum under a pressure to form a three-dimensional electric wiring.


Find Patent Forward Citations

Watanabe, Yoshio. (2010). Multilayer wiring board (U.S. Patent No. 7757394). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7757394

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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