The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Jun. 07, 2007
Applicants:
Manfred Schneegans, Vaterstetten, DE;
Karsten Guth, Soest, DE;
Ivan Galesic, Regensburg, DE;
Inventors:
Assignee:
Infineon Techologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); B23K 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding head includes a pressure plate to press a component (e.g., a semiconductor chip) onto a substrate. The pressure plate includes a holding surface configured to hold the component and to allow the component to be pressed uniformly onto the substrate, thus allowing a particularly reliable connection. The bonding head can further include an apparatus configured to vary the curvature of the holding surface of the pressure plate.