The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7755895 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 13, 2010

Filed:

Feb. 17, 2006
Applicant:

Hironobu Ikeda, Tokyo, JP;

Inventor:

Hironobu Ikeda, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink for an electronic component includes a structure that is bendable.


Find Patent Forward Citations

Ikeda, Hironobu. (2010). Heat sink, an electronic component package, and a method of manufacturing a heat sink (U.S. Patent No. 7755895). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7755895

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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