The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7755694 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 13, 2010

Filed:

Oct. 05, 2007
Applicant:

Fu-yen Tseng, Taipei Hsien, TW;

Inventor:

Fu-Yen Tseng, Taipei Hsien, TW;

Assignee:

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 3/14 (2006.01); H04N 5/335 (2006.01); G02B 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor package is provided. The image sensor package includes a basic body, an image sensor chip, a carrier, and at least one passive component. The image sensor chip is electrically and structurally connected to the basic body, the image sensor package including a sensitive region. The carrier positioned on a supporting portion of the image sensor package spacially surrounding the sensitive region of the image sensor chip. The at least one passive component carried by the carrier and electrically connected to the basic body.


Find Patent Forward Citations

Tseng, Fu-Yen. (2010). Image sensor package and image capture device with same (U.S. Patent No. 7755694). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7755694

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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