The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2010

Filed:

Jan. 22, 2007
Applicants:

Margaret L. Tuma, Strongsville, OH (US);

Joseph S. Collura, Auburn, OH (US);

Henry Helvajian, Pasadena, CA (US);

Michael D. Pocha, Livermore, CA (US);

Glenn A. Meyer, Danville, CA (US);

Charles F. Mcconaghy, Livermore, CA (US);

Barry L. Olsen, Oakdale, CA (US);

William W Hansen, Lakewood, CA (US);

Inventors:

Margaret L. Tuma, Strongsville, OH (US);

Joseph S. Collura, Auburn, OH (US);

Henry Helvajian, Pasadena, CA (US);

Michael D. Pocha, Livermore, CA (US);

Glenn A. Meyer, Danville, CA (US);

Charles F. McConaghy, Livermore, CA (US);

Barry L. Olsen, Oakdale, CA (US);

William W Hansen, Lakewood, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 17/04 (2006.01); H01J 61/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.


Find Patent Forward Citations

Loading…