The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Oct. 16, 2007
Hyun Joo Han, Suwon-si, KR;
Tae Sang Park, Seoul, KR;
SE Yeong Jang, Yongin-si, KR;
Young Jun Moon, Suwon-si, KR;
Jung Hyeon Kim, Hwaseong-si, KR;
Sung Wook Kang, Seoul, KR;
Hyun Joo Han, Suwon-si, KR;
Tae Sang Park, Seoul, KR;
Se Yeong Jang, Yongin-si, KR;
Young Jun Moon, Suwon-si, KR;
Jung Hyeon Kim, Hwaseong-si, KR;
Sung Wook Kang, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.