The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Mar. 01, 2006
Applicant:
Chih-hsiung Lin, Taipei, TW;
Inventor:
Chih-Hsiung Lin, Taipei, TW;
Assignee:
Via Technologies, Inc., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package module with an alignment structure is provided by this invention. The package module comprises a package substrate having a die region and a die disposed thereon. At least one pair of conductive alignment protrusions is disposed in the die region and is separated from each other by the die. A test pad is disposed on the package substrate opposing the die and electrically connected to the pair of conductive alignment protrusions. An electronic device with an alignment structure and an inspection method after mounting is also disclosed.