The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
May. 31, 2006
Yasushi Sasaki, Fukui, JP;
Seiichiro Yokoyama, Tokyo, JP;
Yasushi Sasaki, Fukui, JP;
Seiichiro Yokoyama, Tokyo, JP;
Toyo Boseki Kabushiki Kaisha, Osaka, JP;
Abstract
A high frequency electronic part comprising a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching. The void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm: ratio of the number of voids to film thickness (voids/μm)=the number of voids (voids) in film thickness direction/film thickness (μm).