The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Dec. 25, 2002
Yoshihide Nagafuchi, Otake, JP;
Hirotoshi Mizota, Tokyo, JP;
Yasuo Hiromoto, Yokohama, JP;
Hisaaki Yoshimura, Otake, JP;
Yoichi Nagai, Toyohashi, JP;
Hiroyuki Kumaoka, Otake, JP;
Takeshi Kato, Jakarta, ID;
Tatsuki Yajima, Toyohashi, JP;
Yoshihide Nagafuchi, Otake, JP;
Hirotoshi Mizota, Tokyo, JP;
Yasuo Hiromoto, Yokohama, JP;
Hisaaki Yoshimura, Otake, JP;
Yoichi Nagai, Toyohashi, JP;
Hiroyuki Kumaoka, Otake, JP;
Takeshi Kato, Jakarta, ID;
Tatsuki Yajima, Toyohashi, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
A vinyl-based polymer having a mass average molecular weight of 1500 to 10000, which is prepared by a first step of continuously feeding a material mixture containing a vinyl-based monomer to a continuous tank type first reactor, and polymerizing the vinyl-based monomer under the conditions of a polymerization temperature of 150° to 300° C. and a retention time of 1 to 60 minutes at a rate of polymerization of 50 to 99% to obtain a reaction intermediate mixture; and a second step of feeding a polymerization initiator in the amount of 0.01 to 5 parts by mass based on 100 parts by mass of the vinyl-based monomer and the reaction intermediate mixture to a second reactor, and further polymerizing the vinyl-based monomer under the conditions of a polymerization temperature of 100° to 200° C. and a retention time of 10 to 240 minutes at a rate of polymerization of 80% or more.