The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Sep. 28, 2007
Applicants:
Flavio Villa, Milan, IT;
Gabriele Barlocchi, Cornaredo, IT;
Pietro Corona, Rome, IT;
Inventors:
Assignee:
STMicroelectronics, S.r.l., Agrate Brianza, IT;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process for manufacturing an SOI wafer, including the steps of: forming, in a wafer of semiconductor material, cavities delimiting structures of semiconductor material; thinning out the structures through a thermal process; and completely oxidizing the structures.
Villa, Flavio. (2010). Process for manufacturing a wafer by annealing of buried channels (U.S. Patent No. 7754578). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7754578
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile