Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Abstract

In a flip chip mounted body in which a semiconductor chip () having a plurality of electrode terminals () is disposed so as to be opposed to a wiring board () having a plurality of connection terminals (), with the connection terminals () and the electrode terminals () being connected electrically, a resin () containing electrically conductive particles () is supplied between the connection terminals () and the electrode terminals (), the electrically conductive particles () and the resin () are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles () are allowed to self-assemble between the connection terminals () and the electrode terminals (), thereby forming connectors () that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.