The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Jun. 09, 2005
John E. Epler, San Jose, CA (US);
Oleg B. Shchekin, San Francisco, CA (US);
Franklin J. Wall, Jr., Vacaville, CA (US);
Jonathan J. Wierer, Jr., Pleasanton, CA (US);
Ling Zhou, Dublin, CA (US);
John E. Epler, San Jose, CA (US);
Oleg B. Shchekin, San Francisco, CA (US);
Franklin J. Wall, Jr., Vacaville, CA (US);
Jonathan J. Wierer, Jr., Pleasanton, CA (US);
Ling Zhou, Dublin, CA (US);
Abstract
A semiconductor structure formed on a growth substrate and including a light emitting layer disposed between an n-type region and a p-type region is attached to a carrier by a connection that supports the semiconductor structure sufficiently to permit removal of the growth substrate. In some embodiments, the semiconductor structure is a flip chip device. The semiconductor structure may be attached to the carrier by, for example, a metal bond that supports almost the entire lateral extent of the semiconductor structure, or by interconnects such as solder or gold stud bumps. An underfill material which supports the semiconductor structure is introduced in any spaces between the interconnects. The underfill material may be a liquid that is cured to form a rigid structure. The growth substrate may then be removed without causing damage to the semiconductor structure.