The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Jun. 28, 2007
Karl J. Haltiner, Jr., Fairport, NY (US);
Subhasish Mukerjee, Pittsford, NY (US);
Lawrence A. Chick, West Richland, WA (US);
Kerry D. Meinhardt, Kennewick, WA (US);
Vincent L. Sprenkle, Richland, WA (US);
Kenneth Scott Weil, Richland, WA (US);
Jin Yong Kim, Richland, WA (US);
Karl J. Haltiner, Jr., Fairport, NY (US);
Subhasish Mukerjee, Pittsford, NY (US);
Lawrence A. Chick, West Richland, WA (US);
Kerry D. Meinhardt, Kennewick, WA (US);
Vincent L. Sprenkle, Richland, WA (US);
Kenneth Scott Weil, Richland, WA (US);
Jin Yong Kim, Richland, WA (US);
Delphi Technologies, Inc., Troy, MI (US);
Battelle Memorial Institute, Richland, WA (US);
Abstract
An interconnect system including: a separator plate to provide an anode gas flow space; a first metal interconnect disposed between the separator plate and an anode surface; a nickel oxide paste applied in a pattern over the surface of the anode and adjacent surface of the separator plate which when sintered results in a first conductive layer bonded to the anode and the first interconnect, and a second conductive layer bonded to the first interconnect and the separator plate; a second metal interconnect disposed between a cathode surface of the cell and the separator plate of an adjacent cell cassette; and a silver-containing paste applied over the surface of the cathode and the separator plate which when sintered results in a third conductive layer bonded to the cathode and the second interconnect, and a fourth conductive layer bonded to the second interconnect and the separator plate.