The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Dec. 28, 2007
Keiichi Yamamoto, Kawasaki, JP;
Masakazu Takesue, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Keiichi Yamamoto, Kawasaki, JP;
Masakazu Takesue, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive () is provided on the surface () of a micro component () opposite to the side of a substrate (), and the distal end of a component holding pin () having cross-section area falling within the surface () of the micro component () opposite to the side of the surface () is passed through the thermosetting adhesive () to abut against the surface () of the micro component (). Subsequently, solder () between the micro component () and the substrate () is heated to melt and the component holding pin () is moved in the direction receding from the substrate (). Consequently, the micro component () is removed from the substrate ().