The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2010

Filed:

Mar. 13, 2007
Applicants:

Ho-seong Seo, Suwon-si, KR;

Young-min Lee, Yongin-si, KR;

Youn-ho Choi, Suwon-si, KR;

Inventors:

Ho-Seong Seo, Suwon-si, KR;

Young-Min Lee, Yongin-si, KR;

Youn-Ho Choi, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-Gu, Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a multi-layered printed circuit board including a plurality of insulation layers; a plurality of conductive patterns stacked on the multi-layered printed circuit board while alternating with the insulation layers; an integrated circuit positioned inside a core insulation layer of the insulation layers so as to be embedded in the multi-layered printed circuit board, a plurality of external connection terminal being positioned on a surface of the integrated circuit for external electric connection; and a film attached to a surface of the integrated circuit, the film having a plurality of inner conductive pads in one-to-one electric connection with the external connection terminals, the film being electrically connected to an adjacent conductive pattern layer.


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