The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2010

Filed:

Jun. 18, 2007
Applicants:

Tsutomu Tominaga, Tokyo, JP;

Masahiro Kimata, Tokyo, JP;

Takayuki Kifuku, Tokyo, JP;

Shuzo Akiyama, Tokyo, JP;

Tadayuki Fujimoto, Tokyo, JP;

Inventors:

Tsutomu Tominaga, Tokyo, JP;

Masahiro Kimata, Tokyo, JP;

Takayuki Kifuku, Tokyo, JP;

Shuzo Akiyama, Tokyo, JP;

Tadayuki Fujimoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01); H01B 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.


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