The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Aug. 24, 2006
Applicants:
Won Gu Cho, Seoul, KR;
Ho Min Kang, Suwon-si, KR;
Inventors:
Won Gu Cho, Seoul, KR;
Ho Min Kang, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip and manufacturing method thereof, the semiconductor chip including a plurality of bumps connected to a driving circuit integrated on a semiconductor substrate and an organic insulating layer disposed on the driving circuit. The organic insulating layer extends from the semiconductor substrate less than the plurality of bumps such that a lower edge of the plurality of bumps protrudes further than a lower edge of the organic insulating layer.
Quick Actions:
Cho, Won. (2010). Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate (U.S. Patent No. 7750469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7750469
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile