The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Jan. 10, 2007
Applicant:
Hyoung-ho Roh, Yongin-si, KR;
Inventor:
Hyoung-ho Roh, Yongin-si, KR;
Assignee:
Samsung Techwin Co., Ltd., Changwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a printed circuit board having a structure that can prevent the generation of cracks around a rectangular hole and a method of manufacturing a printed circuit board for a semiconductor package. The printed circuit board includes a base substrate in which at least one window slit is formed, a plurality of circuit patterns formed at least on a side surface of the base substrate, a protective layer formed on the base substrate and the circuit patterns, and a crack preventive layer that is formed along at least a portion of edges of the window slit and is not formed at least on the circuit patterns.