Method of making an optoelectronic module and optoelectronic module obtained by such method

Abstract

The method of making an optoelectronic module (), which includes a first light source circuit () and a second photoreceptor circuit () for picking up light from the first light source circuit reflected on an external surface. A first moulding () with an encapsulation material is made on one part of a lead frame () having several conductive paths () and an external frame () connecting all of the conductive paths. A first light source circuit () is placed on one portion of a first conductive path () of the lead frame that is not covered by the first moulding. A second photoreceptor circuit () is placed on one portion of a second conductive path () of the lead frame not covered by the first moulding. A through opening () is also made in the first moulding () between the external frame () and the location of the first light source circuit () to give access to the first connecting path () and to a third connecting path () for the first light source circuit. The contact pads of the first and second circuits () are connected by metal wires () to corresponding uncovered pads of certain connecting paths () of the lead frame (). The first and third connecting paths () are then cut through the through opening () of the first moulding () in order to insulate electrically the first light source circuit () from the external parts. The light source circuit is thus protected from any electrostatic discharge. A second moulding can then be made on the first moulding () in order to close the through opening and obtain first and second apertures on the first and second circuits () for the passage of light.