The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Dec. 06, 2006
Yasuhiko Inui, Kani, JP;
Takamichi Ogawa, Komaki, JP;
Seiji Ichiyanagi, Niwa-gun, JP;
Jun Otsuka, Konan, JP;
Manabu Sato, Nagoya, JP;
Yasuhiko Inui, Kani, JP;
Takamichi Ogawa, Komaki, JP;
Seiji Ichiyanagi, Niwa-gun, JP;
Jun Otsuka, Konan, JP;
Manabu Sato, Nagoya, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 μm, the dielectric layer has a thickness of from 0.3 to 5 μm, and the conductor layer has a thickness of from 0.3 to 10 μm. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 μm, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 μm, and a minimum via pitch is from 100 to 350 μm.