The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Jun. 04, 2007
Jong-ho Yun, Gyeonggi-do, KR;
Byung-hee Kim, Seoul, KR;
Dae-yong Kim, Gyeonggi-do, KR;
Hyun-su Kim, Gyeonggi-do, KR;
Eun-ji Jung, Gyeonggi-do, KR;
Eun-ok Lee, Incheon-gwangyeoksi, KR;
Jong-Ho Yun, Gyeonggi-do, KR;
Byung-Hee Kim, Seoul, KR;
Dae-Yong Kim, Gyeonggi-do, KR;
Hyun-Su Kim, Gyeonggi-do, KR;
Eun-Ji Jung, Gyeonggi-do, KR;
Eun-Ok Lee, Incheon-gwangyeoksi, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A method of forming a buried interconnection includes removing a semiconductor substrate to form a groove in the semiconductor substrate. A metal layer is formed on inner walls of the groove using an electroless deposition technique. A silicidation process is applied to the substrate having the metal layer, thereby forming a metal silicide layer on the inner walls of the groove.