The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2010

Filed:

Dec. 06, 2005
Applicants:

Shuichi Hirata, Osaka, JP;

Makoto Morikawa, Nara, JP;

Shinya Marumo, Osaka, JP;

Yasuharu Ueno, Osaka, JP;

Takafumi Tsujisawa, Osaka, JP;

Inventors:

Shuichi Hirata, Osaka, JP;

Makoto Morikawa, Nara, JP;

Shinya Marumo, Osaka, JP;

Yasuharu Ueno, Osaka, JP;

Takafumi Tsujisawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A component mounting apparatus has a stagewith a fixed height position for holding a substrate, and a mounting headthat releasably holds a component, is moved downward toward the stagefrom a first reference height position HBfixedly positioned above the stage, and mounts the held componenton the substrateor an already mounted component. A controllerhas a mounting reference height calculation unitfor calculating a mounting reference height Hcorresponding to a distance from the first reference height position HB, and a first target movement height calculation unitfor calculating a first target movement height ZTAGbased on at least the mounting reference height Hand a thickness PTof the componentheld by the mounting head. The controllermoves the mounting headholding the componentdownward from the first reference height position HBto the first target movement height ZTAGto mount the held componenton the substrateor the already mounted component


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