The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Apr. 26, 2007
Leopold Hellinger, Ziersdorf, AT;
Gerhard Neumann, St. Margarethen, AT;
Leopold Hellinger, Ziersdorf, AT;
Gerhard Neumann, St. Margarethen, AT;
Siemens AG Oesterreich, Vienna, AT;
Abstract
There is described an arrangement for cooling electrical components disposed on a board-shaped mounting substrate, particularly SMD power components on a printed circuit board, wherein at least one heat sink assigned to a component is present which is disposed on the same side as the components and which is connected in a thermally conductive manner to the assigned component by means of a thermally conductive layer implemented on the mounting substrate. The heat sink is implemented as a bent sheet-metal part and is connected to the thermally conductive layer by means of a solder joint, wherein the bent sheet-metal part has at least one heat sink element which extends in a longitudinal direction and said longitudinal direction is oriented obliquely to the plane of the board-shaped substrate.