The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2010

Filed:

Feb. 21, 2006
Applicants:

Kinya Nakatsu, Hitachinaka, JP;

Satoshi Ibori, Yachimata, JP;

Hideki Miyazaki, Hitachi, JP;

Inventors:

Kinya Nakatsu, Hitachinaka, JP;

Satoshi Ibori, Yachimata, JP;

Hideki Miyazaki, Hitachi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power module constructs a pressurizing tool by laminating an elastic member as well as a DC positive-side wiring member and DC negative-side wiring member in which currents flow in opposite directions. The pressurizing tool presses a first fixing tool, and then the first fixing tool presses semiconductor equipment. The semiconductor equipment is fixed to a heat dissipating member with its heat dissipating surface brought into surface contact with side wall surfaces of the heat dissipating member. The power module can enhance heat dissipation between a heat dissipating member and semiconductor equipment, and enables the semiconductor equipment to be fixed to the heat dissipating member without adding other components to the power module.


Find Patent Forward Citations

Loading…