The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Jan. 30, 2006
Kenta Ogawa, Kanagawa, JP;
Jun Tsukano, Kanagawa, JP;
Takehiko Maeda, Kanagawa, JP;
Tadanori Shimoto, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Kazuhiro Baba, Tokyo, JP;
Kenta Ogawa, Kanagawa, JP;
Jun Tsukano, Kanagawa, JP;
Takehiko Maeda, Kanagawa, JP;
Tadanori Shimoto, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Kazuhiro Baba, Tokyo, JP;
NEC Electronics Corporation, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
Abstract
An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate includes a first interconnection pattern formed of the first interconnection which includes at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.