The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
May. 22, 2008
Applicants:
Ming-te Lin, Hsinchu, TW;
Chin-yung Chen, Taoyuan County, TW;
Inventors:
Ming-Te Lin, Hsinchu, TW;
Chin-Yung Chen, Taoyuan County, TW;
Assignee:
Raydium Semiconductor Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 15/00 (2006.01); H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.
Lin, Ming-Te. (2010). Assembly structure (U.S. Patent No. 7745726). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7745726
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile