The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2010

Filed:

Oct. 12, 2005
Applicants:

Thomas Eugene Dueber, Wilmington, DE (US);

John D. Summers, Chapel Hill, NC (US);

Brian C. Auman, Pickerington, OH (US);

Munirpallam Appadorai Subramanian, Corvallis, OR (US);

Nyrissa S. Rogado, Wilmington, DE (US);

Inventors:

Thomas Eugene Dueber, Wilmington, DE (US);

John D. Summers, Chapel Hill, NC (US);

Brian C. Auman, Pickerington, OH (US);

Munirpallam Appadorai Subramanian, Corvallis, OR (US);

Nyrissa S. Rogado, Wilmington, DE (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/05 (2006.01); C08K 5/10 (2006.01); C08K 5/103 (2006.01); C08L 79/08 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.


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