The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Aug. 06, 2004
Stefan Boehm, Alsdorf, DE;
Klaus Dilger, Braunschweig, DE;
Elisabeth Stammen, Langerwehe, DE;
Frank Mund, Duesseldorf, DE;
Gero Pokar, Braunschweig, DE;
Jan Wrege, Wolfenbuettel, DE;
Stefan Boehm, Alsdorf, DE;
Klaus Dilger, Braunschweig, DE;
Elisabeth Stammen, Langerwehe, DE;
Frank Mund, Duesseldorf, DE;
Gero Pokar, Braunschweig, DE;
Jan Wrege, Wolfenbuettel, DE;
Technische Universitaet Braunschweig Carolo-Wilhelmina, Braunschweig, DE;
Abstract
A method for gluing microcomponents to a substrate () during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive () to the microcomponent () and/or the substrate (), heating the hot melt type adhesive (), and placing the microcomponent () onto the substrate (). The hot melt type adhesive () is on the contact surfaces between the microcomponent () and the substrate () during and after gluing.