The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2010

Filed:

Jul. 03, 2006
Applicants:

Hidenori Taguchi, Kanagawa, JP;

Shinichi Hashimoto, Kanagawa, JP;

Inventors:

Hidenori Taguchi, Kanagawa, JP;

Shinichi Hashimoto, Kanagawa, JP;

Assignee:

Tyco Electronics Japan G.K., Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.


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