The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Oct. 12, 2006
Applicants:
Thomas Licht, Warstein, DE;
Alfred Kemper, Warstein, DE;
Inventors:
Thomas Licht, Warstein, DE;
Alfred Kemper, Warstein, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05D 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for structured application of a laminatable intermediate layer () to a substrate () for a semiconductor module, wherein a separating layer is indirectly or directly applied to the substrate () over a large surface, the intermediate layer () is applied to the substrate (), including the separating layer(s), by lamination, over a large surface, the intermediate layer () is opened in places on the substrate (), where recesses are provided for the intermediate layer (), and the separating layer () is removed in these places.