The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2010

Filed:

Mar. 30, 2005
Applicants:

Naotaka Kuroda, Tokyo, JP;

Masahiro Tanomura, Tokyo, JP;

Naoto Kurosawa, Kanagawa, JP;

Inventors:

Naotaka Kuroda, Tokyo, JP;

Masahiro Tanomura, Tokyo, JP;

Naoto Kurosawa, Kanagawa, JP;

Assignees:

NEC Corporation, Tokyo, JP;

NEC Electronics Corporation, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/082 (2006.01); H01L 27/102 (2006.01); H01L 29/70 (2006.01); H01L 31/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device having sufficiently high heat dissipation performance while inhibiting an increase in the area of a chip is provided. In semiconductor device, a plurality of HBTsand a plurality of diodesare one-dimensionally and alternately arranged on semiconductor substrate. Anode electrodeof diodeis connected to emitter electrodeof HBTvia common emitter wiring. Diodeworks as heat dissipating elements dissipating to semiconductor substratethe heat transmitted through common emitter wiringfrom emitter electrode, and also works as a protection diode connected in parallel between an emitter and a collector of HBT


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