The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2010

Filed:

Nov. 29, 2007
Applicants:

Nobuya Matsutani, Osaka, JP;

Michio Ohba, Osaka, JP;

Toshiyuki Atsumi, Osaka, JP;

Hitoshi Ishimoto, Hyogo, JP;

Inventors:

Nobuya Matsutani, Osaka, JP;

Michio Ohba, Osaka, JP;

Toshiyuki Atsumi, Osaka, JP;

Hitoshi Ishimoto, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 5/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrodeis formed into a predetermined coil pattern. Bumpsand irregularitiesare formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumpsor irregularitiesallow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.


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