The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7740773 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 22, 2010

Filed:

Mar. 26, 2007
Applicants:

Motoki Iijima, Nagoya, JP;

Tatsuro Nishimura, Nagoya, JP;

Masayuki Nakanishi, Ise, JP;

Inventors:

Motoki Iijima, Nagoya, JP;

Tatsuro Nishimura, Nagoya, JP;

Masayuki Nakanishi, Ise, JP;

Assignees:

Noritake Co., Limited, Nagoya-Shi, JP;

Noritake Itron Corporation, Ise-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a conductive composition and a conductive paste from which a conductive film having a high conductivity and a low thermal expansion coefficient can be formed. The thermal expansion coefficient of an island fixing type conductive layeris compatible with that of a substrate. A cracking of the island fixing type conductive layeror a crack in the substratedue to a difference between these thermal expansion coefficients is suitably inhibited. The thermal expansion coefficient of the island fixing type conductive layeris adjusted by ZWP contained in the range from 10 to 55 (wt %) as a low-expansion filler. Thus, compared with the case where other low-expansion filler is added, the conductivity degradation is inhibited. Accordingly, the island fixing type conductive layerhaving a high conductivity and a high bonding strength is obtained.


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