The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2010

Filed:

Jul. 29, 2004
Applicants:

Yoshihito Hamada, Wakayama, JP;

Kazuo Kubota, Wakayama, JP;

Atsushi Hiraishi, Wakayama, JP;

Jun Kozuka, Wakayama, JP;

Takahiro Kawaguchi, Wakayama, JP;

Tsutomu Miyahara, Wakayama, JP;

Hiroshi Noro, Wakayama, JP;

Koichi Ohori, Wakayama, JP;

Haruyuki Sato, Wakayama, JP;

Inventors:

Yoshihito Hamada, Wakayama, JP;

Kazuo Kubota, Wakayama, JP;

Atsushi Hiraishi, Wakayama, JP;

Jun Kozuka, Wakayama, JP;

Takahiro Kawaguchi, Wakayama, JP;

Tsutomu Miyahara, Wakayama, JP;

Hiroshi Noro, Wakayama, JP;

Koichi Ohori, Wakayama, JP;

Haruyuki Sato, Wakayama, JP;

Assignee:

Kao Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
D21H 17/24 (2006.01); D21H 17/33 (2006.01); D21H 17/44 (2006.01); D21H 21/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The powder composition for paper manufacturing of the invention contains a hydrophobic organic compound (A), an emulsifying and dispersing agent (B), and optionally water-soluble saccharides (C) added based on necessity and has an average particle diameter of 0.1 to 2,000 μm.


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