The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2010

Filed:

Jan. 17, 2008
Applicants:

Yoichi Kitamura, Tokyo, JP;

Minoru Hashimoto, Tokyo, JP;

Tatsuya Kaneko, Kanagawa, JP;

Inventors:

Yoichi Kitamura, Tokyo, JP;

Minoru Hashimoto, Tokyo, JP;

Tatsuya Kaneko, Kanagawa, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.


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