The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2010

Filed:

Aug. 29, 2007
Applicant:

Jocel P. Gomez, Cebu, PH;

Inventor:

Jocel P. Gomez, Cebu, PH;

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor die package including at least two heat sinks. The semiconductor die package includes a first heat sink, a second heat sink coupled to the first heat sink, and a semiconductor die between the first heat sink and the second heat sink. The semiconductor die is electrically coupled to the first heat sink and the second heat sink. The semiconductor die may also be attached to a lead.


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