The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Sep. 05, 2007
Wai Hoong Moy, Penang, MY;
Chu Kun Tan, Penang, MY;
Keh Chin Seah, Penang, MY;
Paul Beng Hui OH, Penang, MY;
Wai Hoong Moy, Penang, MY;
Chu Kun Tan, Penang, MY;
Keh Chin Seah, Penang, MY;
Paul Beng Hui Oh, Penang, MY;
Avago Technologies ECBU IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.