The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
May. 24, 2006
Toshiyuki Ozai, Takasaki, JP;
Naoki Yamakawa, Takasaki, JP;
Toshiyuki Ozai, Takasaki, JP;
Naoki Yamakawa, Takasaki, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1):{(CH═CH)RSiO}(RSiO)(RSiO){OSiR—R—SiR(OR)}  (1)wherein Rrepresents monovalent hydrocarbon groups, Rrepresents an oxygen atom or a bivalent hydrocarbon group, Rrepresents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and Ris a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile