The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2010

Filed:

Jan. 21, 2008
Applicants:

Hideki Hirakawa, Aomori, JP;

Yuko Yamada, Aomori, JP;

Yosuke Yoshizawa, Ibaraki, JP;

Takayuki Hayashizaki, Aomori, JP;

Akira Soma, Aomori, JP;

Shinji Kuniyoshi, Tokyo, JP;

Inventors:

Hideki Hirakawa, Aomori, JP;

Yuko Yamada, Aomori, JP;

Yosuke Yoshizawa, Ibaraki, JP;

Takayuki Hayashizaki, Aomori, JP;

Akira Soma, Aomori, JP;

Shinji Kuniyoshi, Tokyo, JP;

Assignee:

Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way. Thus, the cross-sectional area at the maximum cross-sectional area portion reaching the base portion of the probe tip section can be made to be larger than in the conventional case, and along with the increase of the cross-sectional area, the stress acting on the base portion can be lowered.


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