The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2010

Filed:

Sep. 21, 2005
Applicants:

Seiji Ito, Nabari, JP;

Jun Okada, Toyota, JP;

Inventors:

Seiji Ito, Nabari, JP;

Jun Okada, Toyota, JP;

Assignees:

FTS Co., Ltd., Aichi-ken, JP;

Nitta Moore Company, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F16L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A connection structure for a resin pipe, in which leakage of fluid from between a metal pipe and the resin pipe fitted on the metal pipe is prevented for a long time. In the connection structure, at least two diameter-expanded sections () are formed with a spacing on an end region of a metal pipe (), the spacing between the two diameter-expanded sections () functioning as a circumferential groove () in which a seal ring (SR) is received, and a resin tube () is fitted up to a position beyond a far side diameter-expanded section () of the two diameter-expanded sections (). A back ring (BR) is received in the circumferential groove () together with the seal ring (SR). The diameter-expanded sections () of the metal tube () are formed by bulging or spool shape-forming process.


Find Patent Forward Citations

Ito, Seiji. (2010). Connection structure for resin pipe (U.S. Patent No. 7735877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7735877

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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