The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Nov. 22, 2006
Applicants:
Naruki Kataoka, Tokyo, JP;
Taisuke Ahiko, Nikaho, JP;
Akitoshi Yoshii, Tokyo, JP;
Akira Goshima, Nikaho, JP;
Takashi Aoki, Tokyo, JP;
Tomohiro Sogabe, Tokyo, JP;
Inventors:
Naruki Kataoka, Tokyo, JP;
Taisuke Ahiko, Nikaho, JP;
Akitoshi Yoshii, Tokyo, JP;
Akira Goshima, Nikaho, JP;
Takashi Aoki, Tokyo, JP;
Tomohiro Sogabe, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.