The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2010

Filed:

Oct. 02, 2006
Applicants:

Seitaro Mizuhara, Kyoto, JP;

Naoya Tanaka, Kyoto, JP;

Inventors:

Seitaro Mizuhara, Kyoto, JP;

Naoya Tanaka, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A hybrid integrated circuit device includes: an insulating substrate () having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components () mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs () arranged at the ends of the lower surface of the substrate (), each insulating leg extending in parallel to the lower surface of the substrate (); and a plurality of terminal electrodes () formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes. Each leg is fixed to the substrate by attaching the terminal electrodes to the wiring patterns on the lower surface of the substrate () by soldering or by an electroconductive paste.


Find Patent Forward Citations

Mizuhara, Seitaro. (2010). Hybrid integrated circuit device and method for manufacturing same (U.S. Patent No. 7733668). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7733668

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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