The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2010

Filed:

Aug. 25, 2004
Applicants:

Hiroyuki Yoshimoto, Settsu, JP;

Yasuhiko Sawada, Settsu, JP;

Shunji Kasai, Settsu, JP;

Shuji Tagashira, Settsu, JP;

Inventors:

Hiroyuki Yoshimoto, Settsu, JP;

Yasuhiko Sawada, Settsu, JP;

Shunji Kasai, Settsu, JP;

Shuji Tagashira, Settsu, JP;

Assignee:

Daikin Industries, Ltd., Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/12 (2006.01); C08L 23/00 (2006.01); C08L 23/04 (2006.01); C08L 23/10 (2006.01); C08F 6/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a molded article comprising a polytetrafluoroethylene resin (A) and a thermoplastic resin (B) having a melting point of not lower than 100° C. but lower than 322° C., wherein the maximum peak temperature of the endothermic curve appearing on the crystal melting curve of the above polytetrafluoroethylene resin (A) as measured by a differential scanning calorimeter is higher by at least 3° C. than the maximum peak temperature of the endothermic curve appearing on the crystal melting curve of the above polytetrafluoroethylene resin (A) after heating to a temperature of not lower than 340° C. as measured by the differential scanning calorimeter.


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